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  • ÃâÆÇ»çITCEC
  • ÃâÆÇÀÏ2022-03-22
  • µî·ÏÀÏ2022-12-16
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±¹¹æÀÇ·á ÄÜÅÙÃ÷ ±â¼úÀÇ ±â¼ú¿µÇâ·Â Áö¼ö´Â ¹Ì±¹ (1), ´ëÇѹα¹ (2), ¿µ±¹ (3), µ¶ÀÏ (4), Áß±¹ (5), À̽º¶ó¿¤ (6), ½Ì°¡Æú (7), ÀϺ» (8), ½ºÀ§½º (9), ½º¿þµ§ (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, ¹Ì±¹ ¹× ´ëÇѹα¹ÀÇ ±¹¹æÀÇ·á ÄÜÅÙÃ÷¿¡ ´ëÇÑ ±â¼ú¿µÇâ·ÂÀº ¸Å¿ì ³ôÀº °ÍÀ¸·Î ºÐ¼®µÈ´Ù.

±¹¹æÀÇ·á ÄÜÅÙÃ÷ ±â¼úÀÇ ±â¼ú¿µÇâ·Â Áö¼ö´Â SIEMENS CORPORATION (1), KONINKLIJKE PHILIPS ELECTRONICS N V (2), DEPUY SYNTHES PRODUCTS INC (3),
APPLIED MEDICAL RESOURCES CORP (4), RAYTHEON CO (5), SIEMENS HEALTHCARE LTD (6), STATE GRID CORP CHINA (7), UNIVERSITY BEIHANG (8),
UNIVERSITY ZHEJIANG TECHNOLOGY (9), TENCENT TECH SHENZHEN CO LTD (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, SIEMENS CORPORATION ¹× KONINKLIJKE PHILIPS ELECTRONICS N VÀÇ ±¹¹æÀÇ·á ÄÜÅÙÃ÷¿¡ ´ëÇÑ ±â¼ú¿µÇâ·ÂÀº ¸Å¿ì ³ôÀº °ÍÀ¸·Î ºÐ¼®µÈ´Ù.

±¹¹æÀÇ·á ÄÜÅÙÃ÷ ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â ¹Ì±¹ (1), Áß±¹ (2), µ¶ÀÏ (3), ÀϺ» (4), ÀÌÅ»¸®¾Æ (5), ½º¿þµ§ (6), ÇÁ¶û½º (7), ¿µ±¹ (8), ´ëÇѹα¹ (9), ij³ª´Ù (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, ¹Ì±¹ ¹× Áß±¹Àº ±¹¹æÀÇ·á ÄÜÅÙÃ÷ ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.

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Overview ...............................................................................6
Vision ...................................................................................6
Business Information ............................................................... 7

±¹¹æÀÇ·á ÄÜÅÙÃ÷...................................................................... 9

1. ¸Þ°¡ Æ®·»µå....................................................................... 9
1) ±â¼ú º° Æ®·»µå....................................................................9
2) ±â¼ú¿µÇâ·Â Æ®·»µå............................................................ 10
3) ½ÃÀåÀü¸Á Æ®·»µå .............................................................. 11
4) R&D ÅõÀÚ Æ®·»µå ............................................................. 12

2. ¼±µµ±¹°¡ Æ®·»µå................................................................13
1) ±¹°¡ º° µ¥ÀÌÅÍ..................................................................13
2) ±¹°¡ º° Æ®·»µå..................................................................14
China.................................................................................14
U.S.A.................................................................................15
Germany.............................................................................15
Korea.................................................................................16
Japan.................................................................................17
France................................................................................17
Canada...............................................................................18
Britain.................................................................................19
Italy................................................................................... 19
Switzerland...........................................................................20

3. ¼±µµ±â¾÷ Æ®·»µå.................................................................21
1) ±â¾÷ º° µ¥ÀÌÅÍ..................................................................21
2) ±â¾÷ º° Æ®·»µå................................................................. 22
STATE GRID CORP CHINA......................................................22
UNIVERSITY BEIHANG........................................................... 23
UNIVERSITY ZHEJIANG TECHNOLOGY..................................... 23
UNIVERSITY ZHEJIANG.......................................................... 24
UNIVERSITY XIDIAN...............................................................25
FOSHAN SANSHUI DISTR XIWANG HUPJU
EDUCATIONAL TECH CO LTD................................................. 26
NAT UNIVERSITY DEFENSE TECHNOLOGY............................... 27
SIEMENS CORPORATION..................................................... 28
KONINKLIJKE PHILIPS ELECTRONICS N V..................................28
BEIJING INSTITUTE TECH.......................................................29

4. ±â¼ú¿µÇâ·Â.......................................................................31
4-1) ¼±µµ±¹°¡ ¼øÀ§ ...............................................................31
4-1-1) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â.................................................32
4-1-2) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö..........................................34
4-2) ¼±µµ±â¾÷ ¼øÀ§................................................................36
4-2-1) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â................................................ 37
4-2-2) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö..........................................40

5. ½ÃÀåÀü¸Á.........................................................................43
5-1) ¼±µµ±¹°¡ ¼øÀ§ ..............................................................43
5-1-1) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á...................................................44
5-1-2) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á Áö¼ö .......................................... 46
5-2) ¼±µµ±â¾÷ ¼øÀ§ ..............................................................48
5-2-1) ¼±µµ±â¾÷ ½ÃÀåÀü¸Á......................................................49
5-2-2) ¼±µµ±â¾÷ÀÇ ½ÃÀåÀü¸Á Áö¼ö.............................................52

6. R&D ÅõÀÚ........................................................................55
6-1) ¼±µµ±¹°¡ ¼øÀ§ ..............................................................55
6-1-1) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚ ÃßÀÌ............................................56
6-1-2) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚÁö¼ö ........................................... 58
6-2) ¼±µµ±â¾÷ ¼øÀ§ ............................................................. 60
6-2-1) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚ ÃßÀÌ............................................61
6-2-2) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚÁö¼ö............................................ 64 

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